No Recent Activity
About bgaflipchipunde

Basic Information

About bgaflipchipunde
Biography:
DeepMaterial offers high performing materials for Sintering and Die Attach, Surface Mount, and Wave Soldering applications. The breadth of products includes Silver Sinter Technologies, Solder Paste, Solder Preforms, Underfills and Edgebond, Soldering Alloys, Liquid Soldering Flux, Cored Wire, Surface Mount Adhesives, Electronic Cleaners, and Stencils.
Location:
China
Occupation:
BGA flip chip underfill epoxy adhesive

Statistics


Total Posts
Total Posts
0
Posts Per Day
0
Total Thanks
Total Thanks
0
General Information
Last Activity
09-29-2022 08:16 AM
Join Date
09-29-2022
Home Page
https://www.epoxyadhesiveglue.com/case-in-usa-american-partners-chip-underfill-solution/